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Features: | |
- up to 8 contact sites
- tri- temp from -55 to 175 °C …
- kitable system for QFP, BGA, PGA, QFN and other packages
- throughput up to 5,300 UPH
- contacting: standard, high frequency and Kelvin
- outstanding temperature performance
- installed MT9510 base: more than 450 systems
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Improvements of the XP version | |
- reduced index time from 0,5 to 0,38 sec - upgrade for non XP version (0,4 sec) available
- improved Pick & Place accuracy by means of linear position sensor for output Pick & Place (instead of encoder)
- improved accessibility due to one single cover for the temperature chamber
- new bigger size flat screen on rotary arm
- conversion kit and software compatible
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Handling Solution for | |
- large and small size QFP,BGA, PGA and QFN packages with a pitch down to 0.4mm
- device size from 3x3 to 70x70mm …
- thickness down to 0.5mm
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Applications | |
- automotive power devices
- RF and communication
- logic, analog and microcontrollers
- processors and DSP’s …
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